Call Us +91 1244117090
An ISO 9001:2008 Certified Company

Heat Transfer & Flow Simulation in PCB

The loss of heat from the surface of a PCB to the ambient air is difficult to compute as many process happen at the same time. This situation is much more challenging to describe mathematically since it involves the simultaneous processes of heat spreading by conduction and heat extraction over the surface of the board by convection and radiation. The efficiency of heat transfer from the PCB to air has a significant effect on the temperature difference between the ICs and the air.

This white paper highlights the following:

  • Introduction
  • Heat Transfer by Conduction, Convection & Radiation.
  • Example
    • Low Temperature (COLD) Cycle
    • High Temperature (Dry Heat) Cycle
  • Observation
    • Preparation
    • Improvements
    • Simulation
  • Post Processing Step or Results

Fill the below form and download your free copy today.

Download other whitepapers :

Ultimate guide for enabling RISC-V Based System Development
PCIe Gen 6 Equalization Unraveled
Guide to design FPGA based Flash storage Card with NVMe interface

Quick Enquiry!