A Holistic Co-Design Methodology for Signal, Power, and Thermal Integrity IN AMD Versal™ Adaptive SoC Platforms
Overview
This whitepaper presents a holistic co-design methodology for optimizing signal, power, and thermal integrity in AMD Versal™ Adaptive SoC platforms. It outlines integrated simulation and validation workflows that ensure stability, efficiency, and reliable performance in complex, high-speed designs.
What will you learn from this whitepaper :
- Design Challenges in SI, PI, and Thermal Domains
- Co-Design Methodology
- Domain – Specific Design and Verification
- Validation, Results, and Best Practices
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